Research area 1: Advanced compound materials and heterostructures
• Prof Robert Fickler: Quantum photonics, Photonic integrated circuits, Quantum information Processing, Multimode photonics
• Prof Goery Genty: Nonlinear photonics, Mid-IR sources, Optical computing, Programmable chips
• Prof Mircea Guina: III-V optoelectronics, MID-IR PICs, Clean-room microfabrication, Molecular beam epitaxy
• Prof Regina Gumenyuk: Laser-based manufacturing, Fiber integrated circuits, Specialty fibers, Quantum fiber-based communication
• Prof Laeticia Petit: Glass-based materials, Luminescence, Film, Fiber
• Prof Juha Toivonen: Optical spectroscopy, Chip-scale sensors, Hybrid integration, Applied optics
• Prof Mika Valden: 2D hybrid semiconductor thin films, Interface engineering of the semiconductor nanostructures, Advanced solar cell architectures for energy applications, Synchrotron light mediated spectroscopy methods
Research area 2: Novel Architectures
• Asst. Prof Mohsin Abbas: VLSI architecture, Compute in memory /Neuromorphic computing, Low power AI inference chips, System on Chip (SoC) design
• Prof Robert Fickler: Quantum photonics, Photonic integrated circuits, Quantum information processing, Multimode photonics
• Adj. Prof Mikko Huttunen: Integrated light sources, Nonclassical light, Neuromorphic computing, Reconfigurable photonics
• Prof Pekka Jääskeläinen: Customized processors, Open hardware, EDA, HPC
• Asst. Prof Sergey Kruk: Nanophotonics, Metasurfaces, Quantum optics, Nonlinear optics
• Prof Sayani Majumdar: Neuromorphic computing hardware, 3D monolithic and heterogeneous integration, In-sensor computing, Nonvolatile memories
• Assoc. Prof. Tapio Niemi: Nanophotonics, Photonic integrated circuits, Clean room fabrication, Optical design
• Prof. of Practice Markku-Juhani Saarinen: Cryptography, Root-of-Trust, Physical attacks, RISC-V
• Asst. Prof Vishnu Unnikrishnan: RF integrated circuits, systems, and signal processing; Analog/mixed-signal circuits; Data converters; Communication transceiver circuits
Research area 3: Chip design
• Asst. Prof Mohsin Abbas: VLSI architecture, Compute in memory /Neuromorphic computing, Low power AI inference chips, System on Chip (SoC) design
• Prof Timo D. Hämäläinen: AI-based chip design methods, Open source EDA tools, Large scale SoC designs, Agile chip project management
• Prof Pekka Jääskeläinen: Customized processors, Open hardware, EDA, HPC
• Asst. Prof Alexandre Mercat: 2D and volumetric video coding, Low-level performance optimization, Energy-efficiency, Ecodesign
• Assoc. Prof. Tapio Niemi: Nanophotonics, Photonic integrated circuits, Clean room fabrication, Optical design
• Prof Karri Palovuori: Energetic systems, Virtual reality, Immaterial interfaces, Full-custom VLSI
• Prof. of Practice Markku-Juhani Saarinen: Cryptography, Root-of-Trust, Physical attacks, RISC-V
• Asst. Prof Vishnu Unnikrishnan: RF integrated circuits, systems, and signal processing; Analog/mixed-signal circuits; Data converters; Communication transceiver circuits
• Prof Mikko Valkama: 5G and 6G, Wireless, Radio transceivers
• Prof Jarno Vanne: Real-time video coding, SoC video encoder, High-level synthesis, FPGA prototyping
• Asst. Prof Han Zhou: RF/mm-wave circuits, High-speed transceivers, AI-driven design, Silicon photonics and cryogenic circuits
Research area 4: Advanced packaging
• Prof Mircea Guina: optoelectronics packaging, hybrid-SiPs, RF and thermal simulation, high-precision bonding
• Prof Matti Mäntysalo: Additive manufacturing, Printed electronics, Thin-film devices, Heterogenous integration
• Prof Juha Toivonen: Optical spectroscopy, Chip-scale sensors, Hybrid integration, Applied optics
• Assoc. Prof Jukka Viheriälä: Heterogenous integration, Photonics-electronics co-packaging, WBG power semiconductor packaging, Quantum computer control interfaces
• Asst. Prof Han Zhou: Heterogeneous integration, RF/mm-wave packaging, Integrated waveguides, Electronic-photonic co-packaging