Research group
The Electronics research centre group focuses on flexible, bendable, and stretchable electronics; additive manufacturing, printed thin-film circuits and systems, and integration of additive printed electronics with conventional electronics (i.e., hybrid systems).
Research infrastructure
National Research Infrastructure – Printed Intelligence Infrastructure, PII at LFE has state of the art printing facility includes inkjet printers, gravure, flexo, rotary screen and dry or wet lamination, screen printers, super-inkjet printer, 3D electronics printer, and a plasma printer for high resolution surface energy patterning. Thin-film fabrication line includes a glove box system for device fabricating and characterization. The system includes integrated ALD (thermal and plasma), spin coater, inkjet, and vacuum hot plate as well as combined e-beam and thermal evaporator. Additionally, LFE has in-house developed novel in-situ laser assisted ALD process. Tampere Microscopy Centre provides world-class imaging facilities of the nanoelectronic materials and components. Characterization: Ferroelectric material tester, Semiconductor parameter analyzer, Cryostats with capacity of reaching 1.5K and upto 16T magnetic field, equipped with optical window, probe-stations, pyroelectric analyzer, potentiostat, piezotester, mechanical (stretching, bending, rolling) testing, multi-axial stretching. LFE is co-developer of the SiPFAB pilot line.