Research group
The Advanced Microelectronics Packaging research group develops technologies for heterogeneous and hybrid integration of photonic and electronic systems, with a strong focus on System-in-Package (SiP) fabrication. The work spans integration of active devices, passive components, substrates, and interconnects into scalable and robust system-level architectures. A key focus is on advanced SiP solutions combining high-power electronics, mixed-signal electronics, and photonics within the same package. This includes co-integration of lasers, photonic integrated circuits, detectors, and driver/readout electronics, enabling compact and high-performance systems. The group has strong engagement in emerging applications, particularly quantum technologies, where co-integrated cryogenic photonics and electronics enable scalable quantum computing platforms. Additional application areas include sensing, high-speed data transfer, and harsh-environment/high-power systems. The work emphasises reliability, manufacturability, and transition from laboratory-scale innovation to pilot-line and industrial deployment, with strong support for technology transfer and commercialization.
Research infrastructure
TAU cleanroom facilities and photonics laboratories, including the SiPFAB (System-in-Package Fabrication) pilot line for advanced packaging and heterogeneous integration, where TAU plays a central role at the EU level. Infrastructure includes state-of-the-art capabilities for die and flip-chip bonding, photonic and electronic co-integration, and system-level assembly. The facilities support advanced characterization, including high-speed electrical and optical measurements as well as cryogenic operation, enabling development of next-generation quantum and photonic systems. The infrastructure is complemented by strong national and European collaboration networks and supports both academic research and industrial innovation, including commercialization activities.