Local:
- Tampere Microscopy Centre provides world-class imaging facilities of the nanoelectronic materials and components.
- System-on-Chips Hub having 6×24-core server machines for ASIC development, simulation and physical design, and an FPGA environment for prototyping and development purposes with 30 high-end FPGA boards of which 10 are very large.
- Cleanrooms: about 850m² (ISO 5 and ISO 7) for nanomaterial and semiconductor device processing.
- Micro and nanofabrication infrastructure enables fabrication of samples and devices utilizing IIIV semiconductors, silicon, metals, dielectrics, polymers and photonic glass. Three Molecular Beam Epitaxy (MBE) reactors for synthesis of GaAs, InP, and GaSb-based heterostructures. Further instruments for micro- and nanolithography, thin-film deposition, dry etching, wet processing, annealing, dicing and optical coatings. Interfacing options include methods like flip-chip bonding, wire bonding and uv-glue bonding and laser soldering.
National:
- FinnLight, Finnish National Infrastructure for Light-Based Technologies, a TAU-coordinated consortium of photonics research infrastructures. FinnLight is co-funded by the Research Council of Finland as a national infrastructure. FinnLight is for all classes of photonics materials and process lines for device fabrication offers a wide range of services for the design, fabrication, characterization, and integration of photonics and light-based technologies.
- National Research Infrastructure – Printed Intelligence Infrastructure, PII of the Laboratory for Future Electronics (thin-film fabrication of oxide semiconductors by atomic layer deposition (ALD, thermal and plasma) including device fabrication and characterization).