1. Advanced compound materials and heterostructures
Advanced III-V compound materials and hybrid photonic-electronic heterostructures for cutting edge electronic, sensing, optical, photonic and quantum devices. This area includes also the fabrication of advanced classes of hybrid materials for electronics and optoelectronics including advanced processes for handling semiconductor-dielectric-metal interfaces.
Examples of emerging scientific topics in this area:
- Material sciences: advanced epitaxy of GaSb-based heterostructure for mid-IR photonics applications; monolithic integration of III-V/Si and III-V/oxide interfaces; advanced GaSb quantum-dot systems.
- Advanced integration processes: novel front-end and back-end processes enabling full scale vertical integration of hybrid chips. New processes enabling micro-transfer printing of III-V thin-film devices to CMOS compatible substrates, and laser assisted bonding enabling alignment of photonics/microelectronics chips with sub-micron precision.
- Hybrid microsystems: demonstration of functional building-blocks for quantum communication (quantum key distribution) and on-chip integrated sensors for biomarkers (e.g. glucose, core-body temperature etc.).
2. Novel architectures
Novel architectures will provide new opportunities in the era where we approach the physical limits of traditional computing technologies, especially dealing with big data and artificial intelligence (AI) workloads. This area comprises Near or In-Memory Computing; Neuromorphic Computing; Cryogenic Electronics for Quantum and Space applications.
Examples of emerging scientific topics in this area:
Advanced Next Generation Chips for Unconventional Computing: Neuromorphic Computing – 3D-monolithically or heterogeneously integrated neuromorphic chips with multiple functional units like optical and touch sensing, memory and logic for Near and In-sensor computing with ultralow power operation. For Quantum and Space applications, development of power-efficient cryogenic and radiation-hardened memory technologies together with solid state cooler technologies, leading to zero emission refrigeration on-chip.
3. Chip design
The emphasis of this research area is on SoC and chiplet design methodologies, tools and software support. Advanced design methodologies that can handle both electronic and photonic components are another focus area. Ensuring that designed chips are secure from vulnerabilities and attacks is a growing concern which is an important research track. Within the global political climate, the importance of maintaining and growing local chip design know-how cannot be prioritized too much given the pivotal role computer chips play in our modern society. Designing and verifying ultra low power low latency chips which are secure and reliable at the same time is a grand technical challenge.
Examples of emerging scientific topics in this area:
Utilization of AI in the chip design process. Advanced simulation tools to model system behaviour and validate designs before implementation. Design of efficient AI inference-capable chips. Security and reliability in customized ultra-low latency computing. Design of application specific integrated circuits (ASIC) for edge computing.
4. Advanced packaging
Advanced packaging drives significant improvements in performance, efficiency, and functionality. Thus, it is transformative for the semiconductor industry. This area focuses especially on System-in-Package (SiP), 3D integration and advanced materials (for instance advanced substrates and interconnects are crucial for improving thermal management and electrical performance in advanced packaging). Chips of interest include CMOS, photonics, power electronics, and Micro-Electro-Mechanical Systems (MEMS).
Examples of emerging scientific topics in this area:
- Additive manufacturing presents transformative potential in microelectronics packaging by enabling high-precision, multi-material deposition at micro- and nanoscale resolutions. Challenges include the development of advanced functional materials such as conductive, dielectric, and thermal interfaces optimized for high-resolution printing like aerosol, superinkjet printing, and microdispensing.
- Flexible, stretchable, and conformal electronics represent a rapidly advancing frontier with transformative implications for wearable devices, biomedical systems, soft robotics, and next-generation human-machine interfaces. Challenges lie in the design of novel materials (e.g., stretchable conductors, elastomeric substrates, biocompatible semiconductors) and architectures.
- Co-design and heterogenous integration: additive manufacturing with novel materials and form factors are driving new paradigms in heterogenous integration, miniaturization of interconnects, 3D SiP architectures, offering enhanced performance, reduced form factor, improved thermal performance, and lower production costs.