Background
Chip technologies are essential both for industrial competitiveness and for security of supply in critical technologies. The implementation of the EU Chips Act and the new funding and collaboration structures associated with it open significant opportunities for companies and research. Pirkanmaa has a strong competence base especially in System-on-Chip (SoC) technologies and photonics. The project’s activities aim to strengthen this position even further.
Objectives
– Strengthen RDI (research, development and innovation) activities related to chip technologies in Pirkanmaa and ensure the efficient use of key research infrastructures.
– Increase the utilisation of EU Chips Act opportunities (especially among SMEs and companies applying chip technologies) and improve capabilities to apply for and implement international projects.
– Consolidate and expand the chip ecosystem and build cooperation models between chip developers and application domains (e.g. smart machines, defence industry, health technology, power electronics)
All work is carried out with the principles of sustainable development in mind.
Target groups
– Tampere University research groups developing chips (deployment and versatile utilisation of infrastructures)
– Chip-technology companies in Pirkanmaa
– Companies and ecosystems in Pirkanmaa that gain competitiveness and productivity benefits from adopting chip technologies
– International companies whose establishment in the region is supported
– Startup and scaleup ecosystems and actors connected to international programmes (e.g. NATO DIANA and the European Defence Fund, EDF)
What is done in the project?
Project activities are organised into three work packages:
WP1 Infrastructures: a business-driven infrastructure roadmap and enabling broader use of chip research infrastructures.
WP2 Leveraging EU Chips Act instruments: compiling expertise, thematic information sessions and workshops, generating project concepts, and EU-level advocacy and networking.
WP3 Building and expanding chip ecosystems: scaling the SoC HUB ecosystem, collaboration with application domains, and strengthening the region’s visibility and RDI cooperation.
Expected results and impacts
Concrete results of the project include, for example:
– An infrastructure roadmap and broader deployment of research infrastructures (including method development and strengthening expertise).
– Up-to-date information and shared roadmaps to align research, competence-centre activities and company needs.
– New project concepts and consortia for EU calls, and strengthened international networking.
– A more diversified chip ecosystem and established cooperation models between chip developers and application domains.
Funding
The total project budget is approximately EUR 1 million, of which 70% is EU and state funding (ERDF). The own contribution is 30%, covered from the budgets of Tampere University and Business Tampere. The funding enables the implementation of the project and achievement of its objectives, including infrastructure investments, research and development measures, and international cooperation.
Partners
Key partners include:
Tampere University: Coordinates implementation of the project, is responsible for research and development activities and for developing infrastructure.
Business Tampere: Responsible for company cooperation and ecosystem development.
Regional Council of Pirkanmaa: Supports regional development and provides funding.
Finnish Chips Competence Centre (FiCCC): Responsible for competence-centre activities and international networking.
Company representatives: Participating companies bring an industrial perspective and take part in research and development activities.
Work packages – Summary
Work Package 1: Infrastructures
The objective is to develop and utilise high-level research infrastructure to support RDI in chip technologies:
– An infrastructure roadmap will be prepared together with companies, based on their future needs.
– Equipment investments focus on, for example, wire bonding, chip joining, electron-beam lithography, MBE technology, cryogenic measurements, ALD processes and printed electronics.
– Deployment and training ensure the efficient use of the equipment.
Work Package 2: Leveraging EU Chips Act instruments
The objective is to improve the readiness of regional actors to take advantage of opportunities offered by the EU Chips Act:
– Compiling chip-related expertise and creating a roadmap in cooperation between research groups and the competence centre.
– Information sessions on EU pilot lines, design platforms and funding opportunities.
– Preparation of project consortia through workshops and matchmaking events.
– A plan for EU-level advocacy and participation in national and international networks.
Work Package 3: Consolidating chip ecosystem capabilities
The objective is to strengthen and expand chip-technology ecosystems across different application areas:
– Expanding the SoC HUB ecosystem to include, for example, photonics, power electronics and AI processors.
– Cooperation with other ecosystems such as smart machines, defence and health technology.
– Building a power electronics ecosystem and strengthening international networking.
– Increasing visibility through international events and marketing.
– Expanding RDI cooperation by leveraging the SiPFAB platform.